AML 25th year of wafer bonding! Manufactures unique in-situ aligned wafer bonding machines.
AML’s Aligned Wafer Bonders are the only tool capable of in-situ Alignment, Activation, Chemistry (e.g. Oxide removal) & Bonding all carried out in one chamber.
The incredible flexibility of the tools allows processes that cannot be performed on any other wafer bonder!
Market leading; high vacuum encapsulation, high accuracy alignment of adhesive – polymer bonds.
Flexibility for R&D & the throughput & automation for volume production
AML perfect partner for the development of WLP, 3D integration, TSV and thin wafer handling.
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